Intel and 3DGS Inc. are making significant investments to boost semiconductor manufacturing capabilities in India. They are investing $3.3 billion in a new substrate manufacturing plant located in Odisha's Bhubaneswar-Khurda region. This facility will primarily focus on advanced packaging technologies, which are critical components of the global chip supply chain.
What is being constructed at this facility? The new plant will be dedicated to developing glass core substrates and high-density interconnect substrates. These substrates serve as vital connections between silicon chips and their circuit boards by managing electrical signals and heat dispersion. Glass core substrates, in particular, are designed to outperform traditional organic substrates by enhancing electrical performance and thermal stability.
The plant's construction is anticipated to take five to six years, with plans for it to create more than 1,800 direct high-skilled jobs once operational. This announcement follows an earlier groundbreaking ceremony for India's first advanced 3D glass semiconductor packaging facility held on April 19, 2026, signifying a coordinated effort between Intel and 3DGS rather than a singular investment. A memorandum of understanding has been formalized between both companies and the Odisha government to outline this partnership.
Why is India investing in semiconductors? The establishment of this $3.3 billion facility aligns with India’s Semiconductor Mission, an initiative by the government aimed at reducing the nation's reliance on imported chips. 3DGS brings specialized knowledge in glass substrate technology, which is particularly advantageous for high-performance applications like artificial intelligence, radio frequency, and photonic technologies. This investment reflects a strategic move in the semiconductor industry, ensuring that India enhances its capabilities in this crucial sector.